How to apply underfill adhesive glue dispensing to the bottom of chips on a PCB board?
Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages).
Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautions.
1.Why Use Underfill?
The primary purpose is to enhance the mechanical strength and long-term reliability of chips, especially in products operating under harsh conditions.
1.Resist Mechanical Stress:Prevents solder joint cracking caused by PCB bending, vibration, or impact. Underfill is critical for portable devices like smartphones during drops.
Second Intelligent high precision smt automatic glue dispenser machine apply epoxy resin to the bottom of the PCB board for underfill
Second Intelligent smt automatic glue dispenser automation SEC-DH600L has the following advantages:
● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy;
● Chinese and English operating system, the software interface layout is clear, the operation is simple, easy to learn and understand;
● Support visual inspection, integrated control of dispensing and visual inspection, multi-purpose machine, effective control of dispensing yield;
● It can be equipped with a lin e laser scanner for 3D path guidance and flexible dispensing;
● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic
height measurement, dispensing weighing compensation, five-axis linkage and other functions, which can effectively overcome the difficulties of various dispensing processes and help improve quality;
How to apply underfill adhesive glue dispensing to the bottom of chips on a PCB board? Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages). Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautions. 1.Why Use Underfill? The primary purpose is to enhance the mechanical strength and long-term reliability of chips, especially in products operating under harsh conditions. 1.Resist Mechanical Stress:Prevents solder joint cracking caused by PCB bending, vibration, or impact. Underfill is critical for portable devices like smartphones during drops. Second Intelligent high precision smt automatic glue dispenser machine apply epoxy resin to the bottom of the PCB board for underfill Second Intelligent smt automatic glue dispenser automation SEC-DH600L has the following advantages: ● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy; ● Chinese and English operating system, the software interface layout is clear, the operation is simple, easy to learn and understand; ● Support visual inspection, integrated control of dispensing and visual inspection, multi-purpose machine, effective control of dispensing yield; ● It can be equipped with a lin e laser scanner for 3D path guidance and flexible dispensing; ● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic height measurement, dispensing weighing compensation, five-axis linkage and other functions, which can effectively overcome the difficulties of various dispensing processes and help improve quality;
