How to apply underfill adhesive glue dispensing to the bottom of chips on a PCB board?

Underfilling chips on PCB boards is a precision process primarily used for chips with ball grid arrays on their undersides, such as BGAs (Ball Grid Arrays) and CSPs (Chip-Scale Packages).

Below, I will explain the procedure in detail, covering its purpose, materials, equipment, steps, and precautions.


1.Why Use Underfill?

The primary purpose is to enhance the mechanical strength and long-term reliability of chips, especially in products operating under harsh conditions.

SMT automatic glue dispenser SEC-DH600L

Second Intelligent high precision smt automatic glue dispenser machine apply epoxy resin to the bottom of the PCB board for underfill

Second Intelligent smt automatic glue dispenser automation SEC-DH600L has the following advantages:

● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy;

● Chinese and English operating system, the software interface layout is clear, the operation is simple, easy to learn and understand;

● Support visual inspection, integrated control of dispensing and visual inspection, multi-purpose machine, effective control of dispensing yield;

● It can be equipped with a lin e laser scanner for 3D path guidance and flexible dispensing;

● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic

height measurement, dispensing weighing compensation, five-axis linkage and other functions, which can effectively overcome the difficulties of various dispensing processes and help improve quality;